Semiconductor slicing machineMitsubishi Electric Corporation
DS1000 is a wire-cut electrical discharge machine that efficiently slices wafers from ingots made of the next-generation semiconductor material SiC. 0.1-mm wires are precisely positioned, enabling simultaneous slicing of an ingot into 40 identical wafers. While conventional grinding with an abrasive-coated wire saw has problems with processing time and cutting margin width, electrical discharge slicing is heat-free, enabling faster slicing with narrower margins. Faster cutting speed reduces the cost of next-generation materials.