Dynamic airflow
Laptop
Wistron Corporation
"Dynamic airflow," based on the concept of "Hinge Auto-Extension," refers to a mechanism in which the heat module is automatically extended using an interlocking mechanism. This extension results in the displacement of the heat module to an external position, simultaneously enhancing airflow and causing a shift in the previously overlapping relationship between the motherboard and the thermal component, creating a misalignment.
Client / ManufacturerDesign
Wistron Corporation
HSINCHU, TWWistron Corporation
New Taipei, TWInnovation & Design DivisionDate of Launch
2024
Development Time
up to 24 Month
Target Regions
Africa, Asia, Australia / Oceania, Europe, North America, South America
Target Groups
Consumers / Users