Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
Dynamic airflow
2024

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Dynamic airflow

Laptop

"Dynamic airflow," based on the concept of "Hinge Auto-Extension," refers to a mechanism in which the heat module is automatically extended using an interlocking mechanism. This extension results in the displacement of the heat module to an external position, simultaneously enhancing airflow and causing a shift in the previously overlapping relationship between the motherboard and the thermal component, creating a misalignment.

Client / Manufacturer

Wistron Corporation

HSINCHU, TW
Design

Wistron Corporation

New Taipei, TWInnovation & Design Division
Date of Launch
2024
Development Time
up to 24 Month
Target Regions
Africa, Asia, Australia / Oceania, Europe, North America, South America
Target Groups
Consumers / Users

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